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Proceedings Paper

Infrared thermal-imaging construction fault location
Author(s): David J. Titman
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Paper Abstract

Over the past few years infrared thermal imaging has been considered for a variety of engineering applications and the potential of this method is only now being realised with the range of applications still increasing (1 and 2). As a totally non-destructive method, it has the advantage of providing handsoff mformation quickly. As with other non-destructive or potentially destructive methods, however, there are particular factors which may influence the success of its application and, wherever possible, it should be used in the context of a combined testing approach (3). Because of the relative nature of data produced by a thermographic survey, the quantification of properties of a structure or the materials contained therein may require correlation by confirmatory localised 'destructive' sampling and/or inspection. This paper outlines the principles in operation, the conditions required for the survey to be successful and a range of situations where the technique has proved effective.

Paper Details

Date Published: 1 October 1990
PDF: 8 pages
Proc. SPIE 1320, Infrared Technology and Applications, (1 October 1990); doi: 10.1117/12.22332
Show Author Affiliations
David J. Titman, Harry Stanger Ltd. (United Kingdom)

Published in SPIE Proceedings Vol. 1320:
Infrared Technology and Applications
Alan H. Lettington, Editor(s)

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