
Proceedings Paper
Multiple wavelength silicon photonic 200 mm R+D platform for 25Gb/s and above applicationsFormat | Member Price | Non-Member Price |
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Paper Abstract
A silicon photonics platform that uses a CMOS foundry line is described. Fabrication process is following a modular integration scheme which leads to a flexible platform, allowing different device combinations. A complete device library is demonstrated for 1310 nm applications with state of the art performances. A PDK which includes specific photonic features and which is compatible with commercial EDA tools has been developed allowing an MPW shuttle service. Finally platform evolutions such as device offer extension to 1550 nm or new process modules introduction are presented.
Paper Details
Date Published: 13 May 2016
PDF: 15 pages
Proc. SPIE 9891, Silicon Photonics and Photonic Integrated Circuits V, 98911C (13 May 2016); doi: 10.1117/12.2228744
Published in SPIE Proceedings Vol. 9891:
Silicon Photonics and Photonic Integrated Circuits V
Laurent Vivien; Lorenzo Pavesi; Stefano Pelli, Editor(s)
PDF: 15 pages
Proc. SPIE 9891, Silicon Photonics and Photonic Integrated Circuits V, 98911C (13 May 2016); doi: 10.1117/12.2228744
Show Author Affiliations
B. Szelag, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
B. Blampey, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
T. Ferrotti, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
V. Reboud, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
K. Hassan, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
S. Malhouitre, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
G. Grand, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
D. Fowler, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
S. Brision, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
T. Bria, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
B. Blampey, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
T. Ferrotti, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
V. Reboud, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
K. Hassan, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
S. Malhouitre, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
G. Grand, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
D. Fowler, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
S. Brision, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
T. Bria, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
G. Rabillé, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
P. Brianceau, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
J. M. Hartmann, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
V. Hugues, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
A. Myko, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
F. Elleboode, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
F. Gays, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
J. M. Fédéli, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
C. Kopp, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
P. Brianceau, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
J. M. Hartmann, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
V. Hugues, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
A. Myko, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
F. Elleboode, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
F. Gays, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
J. M. Fédéli, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
C. Kopp, Univ. Grenoble Alpes, CNRS, CEA-LETI (France)
Published in SPIE Proceedings Vol. 9891:
Silicon Photonics and Photonic Integrated Circuits V
Laurent Vivien; Lorenzo Pavesi; Stefano Pelli, Editor(s)
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