
Proceedings Paper
High-speed coherent silicon modulator module using photonic integrated circuits: from circuit design to packaged moduleFormat | Member Price | Non-Member Price |
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Paper Abstract
Silicon photonics technology is an enabler for the integration of complex circuits on a single chip, for various optical link applications such as routing, optical networks on chip, short range links and long haul transmitters. Quadrature Phase Shift Keying (QPSK) transmitters is one of the typical circuits that can be achieved using silicon photonics integrated circuits. The achievement of 25GBd QPSK transmitter modules requires several building blocks to be optimized: the pn junction used to build a BPSK (Binary Shift Phase Keying) modulator, the RF access and the optical interconnect at the package level. In this paper, we describe the various design steps of a BPSK module and the related tests that are needed at every stage of the fabrication process.
Paper Details
Date Published: 13 May 2016
PDF: 10 pages
Proc. SPIE 9891, Silicon Photonics and Photonic Integrated Circuits V, 98910Z (13 May 2016); doi: 10.1117/12.2227411
Published in SPIE Proceedings Vol. 9891:
Silicon Photonics and Photonic Integrated Circuits V
Laurent Vivien; Lorenzo Pavesi; Stefano Pelli, Editor(s)
PDF: 10 pages
Proc. SPIE 9891, Silicon Photonics and Photonic Integrated Circuits V, 98910Z (13 May 2016); doi: 10.1117/12.2227411
Show Author Affiliations
S. Bernabé, Univ. Grenoble Alpes, CEA-LETI (France)
S. Olivier, Univ. Grenoble Alpes, CEA-LETI (France)
A. Myko, Univ. Grenoble Alpes, CEA-LETI (France)
M. Fournier, Univ. Grenoble Alpes, CEA-LETI (France)
B. Blampey, Univ. Grenoble Alpes, CEA-LETI (France)
A. Abraham, Univ. Grenoble Alpes, CEA-LETI (France)
S. Menezo, Univ. Grenoble Alpes, CEA-LETI (France)
J. Hauden, iXBlue SAS (France)
A. Mottet, iXBlue SAS (France)
S. Olivier, Univ. Grenoble Alpes, CEA-LETI (France)
A. Myko, Univ. Grenoble Alpes, CEA-LETI (France)
M. Fournier, Univ. Grenoble Alpes, CEA-LETI (France)
B. Blampey, Univ. Grenoble Alpes, CEA-LETI (France)
A. Abraham, Univ. Grenoble Alpes, CEA-LETI (France)
S. Menezo, Univ. Grenoble Alpes, CEA-LETI (France)
J. Hauden, iXBlue SAS (France)
A. Mottet, iXBlue SAS (France)
K. Frigui, XLIM Institute, CNRS, Univ. de Limoges (France)
S. Ngoho, XLIM Institute, CNRS, Univ. de Limoges (France)
B. Frigui, CISTEME Limoges (France)
S. Bila, XLIM Institute, CNRS, Univ. de Limoges (France)
D. Marris-Morini, Institut d'Électronique Fondamentale, Univ. Paris-Saclay, CNRS (France)
D. Pérez-Galacho, Institut d'Électronique Fondamentale, Univ. Paris-Saclay, CNRS (France)
P. Brindel, Nokia Bell Labs. (France)
G. Charlet, Nokia Bell Labs. (France)
S. Ngoho, XLIM Institute, CNRS, Univ. de Limoges (France)
B. Frigui, CISTEME Limoges (France)
S. Bila, XLIM Institute, CNRS, Univ. de Limoges (France)
D. Marris-Morini, Institut d'Électronique Fondamentale, Univ. Paris-Saclay, CNRS (France)
D. Pérez-Galacho, Institut d'Électronique Fondamentale, Univ. Paris-Saclay, CNRS (France)
P. Brindel, Nokia Bell Labs. (France)
G. Charlet, Nokia Bell Labs. (France)
Published in SPIE Proceedings Vol. 9891:
Silicon Photonics and Photonic Integrated Circuits V
Laurent Vivien; Lorenzo Pavesi; Stefano Pelli, Editor(s)
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