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Proceedings Paper

Design and fabrication of micromachined electron guns (MEGs) usinga multiple-level planar tungsten process
Author(s): Wolfgang Hofmann; Liang-Yuh Chen; Noel C. MacDonald
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Paper Abstract

We report on the fabrication and design of micro-machined electron guns (MEGs). The fabrication relies entirely on standard integrated circuit technology and allows the fabrication of large MEG arrays. Silicon field emitters are formed by thermal oxidation and the self- aligned submicron aperture gate electrode is fabricated using selective chemical vapor deposition of tungsten. Additional levels of tungsten electrodes are integrated using the selective tungsten multiple-level planar process. We present a brief review of the fabrication sequence, discuss the electro-mechanical and electron-optical design issues and present specific designs.

Paper Details

Date Published: 26 September 1995
PDF: 11 pages
Proc. SPIE 2640, Microlithography and Metrology in Micromachining, (26 September 1995); doi: 10.1117/12.222640
Show Author Affiliations
Wolfgang Hofmann, Cornell Univ. (United States)
Liang-Yuh Chen, Cornell Univ. (United States)
Noel C. MacDonald, Cornell Univ. (United States)

Published in SPIE Proceedings Vol. 2640:
Microlithography and Metrology in Micromachining
Michael T. Postek, Editor(s)

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