Share Email Print

Proceedings Paper

Mixed-mode, high-order multi-patterning control strategy with small-spot, optical CD metrology on device structures
Author(s): Hugo Cramer; Baukje Wisse; Stefan Kruijswijk; Thomas Theeuwes; Yi Song; Wei Guo; Alok Verma; Rui Zhang; Yvon Chai; Sharon Hsu; Rahul Khandelwal; Giacomo Miceli; Steven Welch; Kyu-Tae Sun; Taeddy Kim; Jin-Moo Byun; Sang-Hoon Jung; Moo-Young Seo; Hyun-Sok Kim; Dong-Gyu Park; Jong-Mun Jeong
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The high-NA angle-resolved scatterometer YieldStar 1250D, with a small 12x12μm2 inspection area, has been used to inspect CD variation After Develop (ADI) and After Partition/Final Etch (APEI/AFEI) on various layers and features of a HVM DRAM process. During recipe set-up, CD-SEM data were used to verify full recipe quality. The high sampling density enabled by the small inspection area and high speed of the YieldStar angle-resolved scatterometer could be used to reveal various kinds of CD variations. An intra-field control-loop with scanner dose corrections was tested, using very dense ADI and APEI measurements, 400ppf, 4fields. This strategy demonstrated a 21% improvement in intra-field CDU, in line with expectations from predictions. Inter-field control loops with different strategies have been simulated for APEI CD control. To capture all variations in the inter-field fingerprints a dense sampling, 24ppf full wafer, in combination with a dynamic, context-based control strategy, appeared to be necessary. An improvement of 30% of the wafer CDU (excluding the intra-field) is feasible. For the Self-Aligned Double Patterning process, essential for the dense DRAM cells, the CD variation at APEI contributes to pitch-walking at final etch. Pitch walking is an alternating OV error, therefore these control strategies will also contribute to improvement of the OV control budget.

Paper Details

Date Published: 24 March 2016
PDF: 10 pages
Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97782E (24 March 2016); doi: 10.1117/12.2220782
Show Author Affiliations
Hugo Cramer, ASML Netherlands B.V. (Netherlands)
Baukje Wisse, ASML Netherlands B.V. (Netherlands)
Stefan Kruijswijk, ASML Netherlands B.V. (Netherlands)
Thomas Theeuwes, ASML Netherlands B.V. (Netherlands)
Yi Song, ASML Netherlands B.V. (Netherlands)
Wei Guo, ASML Netherlands B.V. (Netherlands)
Alok Verma, ASML Netherlands B.V. (Netherlands)
Rui Zhang, ASML Netherlands B.V. (Netherlands)
Yvon Chai, ASML Netherlands B.V. (Netherlands)
Sharon Hsu, ASML Netherlands B.V. (Netherlands)
Rahul Khandelwal, ASML Netherlands B.V. (Netherlands)
Giacomo Miceli, ASML Netherlands B.V. (Netherlands)
Steven Welch, ASML Netherlands B.V. (Netherlands)
Kyu-Tae Sun, ASML Korea Co. Ltd. (Korea, Republic of)
Taeddy Kim, ASML Korea Co. Ltd. (Korea, Republic of)
Jin-Moo Byun, ASML Korea Co. Ltd. (Korea, Republic of)
Sang-Hoon Jung, ASML Korea Co. Ltd. (Korea, Republic of)
Moo-Young Seo, SK Hynix, Inc. (Korea, Republic of)
Hyun-Sok Kim, SK Hynix, Inc. (Korea, Republic of)
Dong-Gyu Park, SK Hynix, Inc. (Korea, Republic of)
Jong-Mun Jeong, SK Hynix, Inc. (Korea, Republic of)

Published in SPIE Proceedings Vol. 9778:
Metrology, Inspection, and Process Control for Microlithography XXX
Martha I. Sanchez, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?