Proceedings Paper
PMMA removal selectivity to PS using dry etch approach: sub-10nm patterning application| Format | Member Price | Non-Member Price |
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Paper Abstract
For sub-10nm technologies, the semiconductor industry is facing the limits of conventional lithography to achieve narrow dimensions. DSA (Directed Self-Assembly) of Block Copolymers (BCP) is one of the most promising solutions to reach sub-10nm patterns with a high density. One challenge for DSA integration is the removal of PMMA selectively to PS. In this paper, we propose to study PMMA removal selectively to PS by screening different plasma etch chemistries. These chemistries developed on blanket wafers have been tested on cylindrical and lamellar patterned wafers.
Paper Details
Date Published: 23 March 2016
PDF: 11 pages
Proc. SPIE 9782, Advanced Etch Technology for Nanopatterning V, 97820G (23 March 2016); doi: 10.1117/12.2220586
Published in SPIE Proceedings Vol. 9782:
Advanced Etch Technology for Nanopatterning V
Qinghuang Lin; Sebastian U. Engelmann, Editor(s)
PDF: 11 pages
Proc. SPIE 9782, Advanced Etch Technology for Nanopatterning V, 97820G (23 March 2016); doi: 10.1117/12.2220586
Show Author Affiliations
A. Sarrazin, CEA-LETI (France)
N. Posseme, CEA-LETI (France)
P. Pimenta Barros, CEA-LETI (France)
S. Barnola, CEA-LETI (France)
G. Claveau, CEA-LETI (France)
A. Gharbi, CEA-LETI (France)
N. Posseme, CEA-LETI (France)
P. Pimenta Barros, CEA-LETI (France)
S. Barnola, CEA-LETI (France)
G. Claveau, CEA-LETI (France)
A. Gharbi, CEA-LETI (France)
M. Argoud, CEA-LETI (France)
G. Chamiot-Maitral, CEA-LETI (France)
R. Tiron, CEA-LETI (France)
C. Nicolet, Arkema S.A. (France)
C. Navarro, Arkema S.A. (France)
C. Cardinaud, Institut des Matériaux Jean Rouxel, CNRS (France)
G. Chamiot-Maitral, CEA-LETI (France)
R. Tiron, CEA-LETI (France)
C. Nicolet, Arkema S.A. (France)
C. Navarro, Arkema S.A. (France)
C. Cardinaud, Institut des Matériaux Jean Rouxel, CNRS (France)
Published in SPIE Proceedings Vol. 9782:
Advanced Etch Technology for Nanopatterning V
Qinghuang Lin; Sebastian U. Engelmann, Editor(s)
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