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Proceedings Paper

Study on overlay AEI-ADI shift on contact layer of advanced technology node
Author(s): Guogui Deng; Jingan Hao; Lihong Xiao; Bin Xing; Yuntao Jiang; Kaiting He; Qiang Zhang; Weiming He; Chang Liu; Yi-Shih Lin; Qiang Wu; Xuelong Shi
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Paper Abstract

In this paper, we present a study on the overlay (OVL) shift issue in contact (CT) layer aligned to poly-silicon (short as poly) layer (prior layer) in an advanced technology node [1, 2]. We have showed the wafer level OVL AEI-ADI shift (AEI: After Etch Inspection; ADI: After Developing Inspection; AEI-ADI: AEI minus ADI). Within the shot level map, there exists a center-edge difference. The OVL focus subtraction map can well match the OVL AEI-ADI shift map. Investigation into this interesting correlation finally leads to the conclusion of PR tilt. The film stress of the thick hard mask is responsible for the PR tilt. The method of OVL focus subtraction can therefore be a powerful and convenient tool to represent the OVL mark profile. It is also important to take into account the film deposition when investigating OVL AEI-ADI shift.

Paper Details

Date Published: 8 March 2016
PDF: 13 pages
Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97782C (8 March 2016); doi: 10.1117/12.2220013
Show Author Affiliations
Guogui Deng, Semiconductor Manufacturing International Corp. (China)
Jingan Hao, Semiconductor Manufacturing International Corp. (China)
Lihong Xiao, Semiconductor Manufacturing International Corp. (China)
Bin Xing, Semiconductor Manufacturing International Corp. (China)
Yuntao Jiang, Semiconductor Manufacturing International Corp. (China)
Kaiting He, Semiconductor Manufacturing International Corp. (China)
Qiang Zhang, Semiconductor Manufacturing International Corp. (China)
Weiming He, Semiconductor Manufacturing International Corp. (China)
Chang Liu, Semiconductor Manufacturing International Corp. (China)
Yi-Shih Lin, Semiconductor Manufacturing International Corp. (China)
Qiang Wu, Semiconductor Manufacturing International Corp. (China)
Xuelong Shi, Semiconductor Manufacturing International Corp. (China)


Published in SPIE Proceedings Vol. 9778:
Metrology, Inspection, and Process Control for Microlithography XXX
Martha I. Sanchez, Editor(s)

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