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Proceedings Paper

DSA materials contributions to the defectivity performance of 14nm half-pitch LiNe flow at IMEC
Author(s): Hari Pathangi; Varun Vaid; Boon Teik Chan; Nadia Vandenbroeck; Jin Li; Sung Eun Hong; Yi Cao; Baskaran Durairaj; Guanyang Lin; Mark Somervell; Takahiro Kitano; Ryota Harukawa; Kaushik Sah; Andrew Cross; Hareen Bayana; Lucia D’Urzo; Roel Gronheid
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Paper Abstract

This manuscript shows the relationship between defectivity of a typical chemo-epitaxy sequence and the DSA-specific materials, namely the mat, the brush and the block co-polymer. We demonstrate that the density of assembly defects in a line-space DSA flow, namely the dislocations and 1-period bridges have a direct correlation to certain parameters in the synthesis sequence of these materials. The primary focus of this manuscript is on identifying, controlling and reproducing the defects-critical parameters in the block co-polymer synthesis process for a stable and low defect performance of DSA flows.

Paper Details

Date Published: 22 March 2016
PDF: 6 pages
Proc. SPIE 9777, Alternative Lithographic Technologies VIII, 97770G (22 March 2016); doi: 10.1117/12.2219936
Show Author Affiliations
Hari Pathangi, IMEC (Belgium)
Varun Vaid, IMEC (Belgium)
Boon Teik Chan, IMEC (Belgium)
Nadia Vandenbroeck, IMEC (Belgium)
Jin Li, EMD Performance Materials Corp. (Belgium)
Sung Eun Hong, EMD Performance Materials Corp. (United States)
Yi Cao, EMD Performance Materials Corp. (United States)
Baskaran Durairaj, EMD Performance Materials Corp. (United States)
Guanyang Lin, EMD Performance Materials Corp. (United States)
Mark Somervell, Tokyo Electron America, Inc. (United States)
Takahiro Kitano, Tokyo Electron Kyushu Ltd. (Japan)
Ryota Harukawa, KLA-Tencor Corp. (United States)
Kaushik Sah, KLA-Tencor Corp. (United States)
Andrew Cross, KLA-Tencor Corp. (United States)
Hareen Bayana, Entegris GmbH (Germany)
Lucia D’Urzo, Entegris GmbH (Germany)
Roel Gronheid, IMEC (Belgium)

Published in SPIE Proceedings Vol. 9777:
Alternative Lithographic Technologies VIII
Christopher Bencher, Editor(s)

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