Directed Self-Assembly (DSA) is a well-known candidate for next generation sub-15nm half-pitch lithography. ^[1-2] DSA processes on 300mm wafers have been demonstrated for several years, and have given a strong impression due to finer pattern results. ^[3-4] On t he other hand, specific issues with DSA processes have begun to be clear as a result of these recent challenges. ^[5-6] Pattern placement error, which means the pattern shift after DSA fabrication, is recognized as one of these typical issues. Coat-Develop Track systems contribute to the DSA pattern fabrication and also influence the DSA pattern performance.^[4] In this study, the placement error was investigated using a simple contact-hole pattern and subsequent contact-hole shrink process implemented on the SOKUDO DUO track. Thus, we will show the placement error of contact-hole shrink using a DSA process and discuss the difference between DSA and other shrink methods.

Date Published: 1 April 2016
PDF: 7 pages
Proc. SPIE 9777, Alternative Lithographic Technologies VIII, 97770O (1 April 2016); doi: 10.1117/12.2219925

Published in SPIE Proceedings Vol. 9777:
Alternative Lithographic Technologies VIII
Christopher Bencher, Editor(s)