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Proceedings Paper

Photolithography reaches 6 nm half-pitch using EUV light
Author(s): Daniel Fan; Yasin Ekinci
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Paper Abstract

EUV interference lithography records the interference pattern of two diffracted, coherent light beams, where the pattern resolution is half the diffraction grating resolution. The fabrication of diffraction grating masks by e-beam lithography is restricted by the electron proximity effect and pattern transfer limitations into diffraction efficient materials. By patterning HSQ lines at a relaxed pitch to avoid the electron proximity effect, depositing conformal iridium via atomic layer deposition, followed by ion milling the top and bottom iridium and HSQ removal, we fabricated iridium diffraction gratings at double the line spacing of the original HSQ lines. 6 nm half-pitch patterns were achieved using these masks marking a new record resolution in photolithography.

Paper Details

Date Published: 18 March 2016
PDF: 11 pages
Proc. SPIE 9776, Extreme Ultraviolet (EUV) Lithography VII, 97761V (18 March 2016); doi: 10.1117/12.2219737
Show Author Affiliations
Daniel Fan, Paul Scherrer Institut (Switzerland)
Yasin Ekinci, Paul Scherrer Institut (Switzerland)

Published in SPIE Proceedings Vol. 9776:
Extreme Ultraviolet (EUV) Lithography VII
Eric M. Panning, Editor(s)

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