In this work, we present completely industry adapted processes for high-chi PS-PDMS block copolymers. DSA was performed on trenches fabricated within standard photolithography stacks and pattern transfer was made by using etching processes similar to those used for gate etching in industry. We propose the alignment of two different PS-PDMS (45.5kg/mol, 16kg/mol) solely by thermal annealing. By adding plasticizer molecules in the high molecular weight BCP (45.5k), we have not only avoided solvent vapor annealing but also reduced significantly the processing time. The properties of the guiding lines and the quality of the final BCP hard mask (CD uniformity, LWR, LER) were investigated.

Date Published: 1 April 2016
PDF: 10 pages
Proc. SPIE 9777, Alternative Lithographic Technologies VIII, 97771W (1 April 2016); doi: 10.1117/12.2219312

Published in SPIE Proceedings Vol. 9777:
Alternative Lithographic Technologies VIII
Christopher Bencher, Editor(s)