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Proceedings Paper

Design of new block copolymer systems to achieve thick films with defect-free structures for applications of DSA into lithographic large nodes
Author(s): X. Chevalier; P. Coupillaud; G. Lombard; C. Nicolet; J. Beausoleil; G. Fleury; M. Zelsmann; P. Bezard; G. Cunge; J. Berron; K. Sakavuyi; A. Gharbi; R. Tiron; G. Hadziioannou; C. Navarro; I. Cayrefourcq
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Paper Abstract

Properties of new block copolymers systems, specifically designed to reach large periods for the features, are compared to the ones exhibited by classical PS-b-PMMA materials of same dimensions. Conducted studies, like free-surface defects analysis, mild-plasma tomography experiments, graphoepitaxy-guided structures, etch-transfer… indicate much better performances, in terms of achievable film-thicknesses with perpendicular features, defects levels, and dimensional uniformities, for the new system than for the classical PS-b-PMMA. These results clearly highlight unique and original solutions toward an early introduction of DSA technology into large lithographic nodes.

Paper Details

Date Published: 25 March 2016
PDF: 11 pages
Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 977913 (25 March 2016); doi: 10.1117/12.2219214
Show Author Affiliations
X. Chevalier, Arkema France (France)
P. Coupillaud, LPCO, CNRS, Univ. Bordeaux 1 (France)
G. Lombard, Arkema France (France)
C. Nicolet, Arkema France (France)
J. Beausoleil, Arkema France (France)
G. Fleury, LPCO, CNRS, Univ. Bordeaux 1 (France)
M. Zelsmann, LTM-CNRS, MINATEC (France)
P. Bezard, LTM-CNRS, MINATEC (France)
G. Cunge, LTM-CNRS, MINATEC (France)
J. Berron, Brewer Science Inc. (United States)
K. Sakavuyi, Brewer Science Inc. (United States)
A. Gharbi, CEA-LETI, MINATEC (France)
R. Tiron, CEA-LETI, MINATEC (France)
G. Hadziioannou, LPCO, CNRS, Univ. Bordeaux 1 (France)
C. Navarro, Arkema France (France)
I. Cayrefourcq, Arkema France (France)

Published in SPIE Proceedings Vol. 9779:
Advances in Patterning Materials and Processes XXXIII
Christoph K. Hohle; Rick Uchida, Editor(s)

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