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Proceedings Paper

Surface affinity role in graphoepitaxy of lamellar block copolymers
Author(s): G. Claveau; P. Quemere; M. Argoud; J. Hazart; P. Pimenta Barros; A. Sarrazin; N. Posseme; R. Tiron; X. Chevalier; C. Nicolet; C. Navarro
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Paper Abstract

Overcoming the optical limitations of 193nm immersion lithography can be achieved using Directed Self Assembly (DSA) of block-copolymers (BCPs) as a low-cost and versatile complementary technique. The goal of this paper is to investigate the potential of DSA to address line and space (L/S) high resolution patterning by performing the density multiplication of lines with the graphoepitaxy approach. As surface affinity is a key parameter in self-assembly, three variations, or "flavors", of DSA template affinity are investigated regarding several success criteria such as morphology control or defectivity. More precisely, both the methodology to register DSA defects and the impact of process parameters on defectivity are detailed. Using the 300mm pilot line available in LETI and Arkema’s advanced materials, we investigate process optimization of DSA line/space patterning of a 38nm period lamellar PS-b-PMMA BCP (L38). For this study, our integration scheme, depicted in figure 2-1, is based on BCP self-assembly inside organic hard mask guiding patterns obtained using 193i nm lithography. Defect analysis coupled with the fine tuning of process parameters (annealing, brush material) provided the optimum conditions for the L38 self-assembly. Using such conditions, DSA using the three affinity flavors is investigated by means of SEM top-view and cross-section review. Lithographic performances of one selected flavor are then evaluated with the comparison of Process Windows (PWs) function of either commensurability, morphology or LWR. This work is a first step in finding the best process for an industrial graphoepitaxy approach.

Paper Details

Date Published: 21 March 2016
PDF: 14 pages
Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 97791F (21 March 2016); doi: 10.1117/12.2219131
Show Author Affiliations
G. Claveau, CEA-LETI, MINATEC (France)
P. Quemere, CEA-LETI, MINATEC (France)
M. Argoud, CEA-LETI, MINATEC (France)
J. Hazart, CEA-LETI, MINATEC (France)
P. Pimenta Barros, CEA-LETI, MINATEC (France)
A. Sarrazin, CEA-LETI, MINATEC (France)
N. Posseme, CEA-LETI, MINATEC (France)
R. Tiron, CEA-LETI, MINATEC (France)
X. Chevalier, Arkema France (France)
C. Nicolet, Arkema France (France)
C. Navarro, Arkema France (France)

Published in SPIE Proceedings Vol. 9779:
Advances in Patterning Materials and Processes XXXIII
Christoph K. Hohle; Rick Uchida, Editor(s)

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