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Proceedings Paper

Experimental research of digital image correlation system in high temperature test
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Paper Abstract

Digital Image Correlation (DIC) is a full-field technique based on white-light illumination for displacement and strain measurement. But radiation on the specimen surface at high temperature affects the quality of acquired speckle pattern images for traditional DIC measurement. In order to minimize the radiation effect in high temperature measurement, this paper proposes a two-dimensional ultraviolet digital image correlation system (2D UV-DIC) containing UV LED and UV band-pass filter. It is confirmed by experiments that images acquired by this system saturate at higher temperature in comparison with DIC using filtered blue light imaging system. And the UV-DIC remains minimally affected by radiation at the temperature which is nearing the specimen’s maximum working temperature (about 1250°C). In addition, considering the heat disturbance that can’t be ignored in actual high temperature measurement, this paper also proposes a method using an air controller in combination with image average algorithm, and the method was then used to obtain the thermal expansion coefficient of the Austenitic chromium-nickel stainless steel specimen at different temperatures. By comparing the coefficients with the results calculated by other method, it shows that this comprehensive method has the advantages of strong anti-interference ability and high precision.

Paper Details

Date Published: 26 January 2016
PDF: 8 pages
Proc. SPIE 9903, Seventh International Symposium on Precision Mechanical Measurements, 990306 (26 January 2016); doi: 10.1117/12.2217703
Show Author Affiliations
Li Chen, Hefei Univ. of Technology (China)
Yonghong Wang, Hefei Univ of Technology (China)
Xizuo Dan, Hefei Univ. of Technology (China)
Ying Xiao, Hefei Univ. of Technology (China)
Lianxiang Yang, Hefei Univ. of Technology (China)
Oakland Univ. (United States)

Published in SPIE Proceedings Vol. 9903:
Seventh International Symposium on Precision Mechanical Measurements
Liandong Yu, Editor(s)

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