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Proceedings Paper

Progress in high-power high-speed VCSEL arrays
Author(s): Richard F. Carson; Mial E. Warren; Preethi Dacha; Thomas Wilcox; John G. Maynard; David J. Abell; Kirk J. Otis; James A. Lott
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Paper Abstract

Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. These substrate-emitting VCSEL arrays can also make use of integrated micro-lenses for beam shaping and directional control. Advances in the performance of these laser arrays will be reviewed and emerging applications are discussed.

Paper Details

Date Published: 18 March 2016
PDF: 14 pages
Proc. SPIE 9766, Vertical-Cavity Surface-Emitting Lasers XX, 97660B (18 March 2016); doi: 10.1117/12.2215009
Show Author Affiliations
Richard F. Carson, TriLumina Corp. (United States)
Mial E. Warren, TriLumina Corp. (United States)
Preethi Dacha, TriLumina Corp. (United States)
Thomas Wilcox, TriLumina Corp. (United States)
John G. Maynard, TriLumina Corp. (United States)
David J. Abell, TriLumina Corp. (United States)
Kirk J. Otis, TriLumina Corp. (United States)
James A. Lott, Technische Univ. Berlin (Germany)

Published in SPIE Proceedings Vol. 9766:
Vertical-Cavity Surface-Emitting Lasers XX
Kent D. Choquette; James K. Guenter, Editor(s)

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