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Proceedings Paper

Precise 3D printing of micro/nanostructures using highly conductive carbon nanotube-thiol-acrylate composites
Author(s): Y. Liu; W. Xiong; L. J. Jiang; Y. S. Zhou; Y. F. Lu
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Paper Abstract

Two-photon polymerization (TPP) is of increasing interest due to its unique combination of truly three-dimensional (3D) fabrication capability and ultrahigh spatial resolution of ~40 nm. However, the stringent requirements of non-linear resins seriously limit the material functionality of 3D printing via TPP. Precise fabrication of 3D micro/nanostructures with multi-functionalities such as high electrical conductivity and mechanical strength is still a long-standing challenge. In this work, TPP fabrication of arbitrary 3D micro/nanostructures using multi-walled carbon nanotube (MWNT)-thiolacrylate (MTA) composite resins has been developed. Up to 0.2 wt% MWNTs have been incorporated into thiol-acrylate resins to form highly stable and uniform composite photoresists without obvious degradation for one week at room temperature. Various functional 3D micro/nanostructures including woodpiles, micro-coils, spiral-like photonic crystals, suspended micro-bridges, micro-gears and complex micro-cars have been successfully fabricated. The MTA composite resin offers significant enhancements in electrical conductivity and mechanical strength, and on the same time, preserving high optical transmittance and flexibility. Tightly controlled alignment of MWNTs and the strong anisotropy effect were confirmed. Microelectronic devices including capacitors and resistors made of the MTA composite polymer were demonstrated. The 3D micro/nanofabrication using the MTA composite resins enables the precise 3D printing of micro/nanostructures of high electrical conductivity and mechanical strength, which is expected to lead a wide range of device applications, including micro/nano-electromechanical systems (MEMS/NEMS), integrated photonics and 3D electronics.

Paper Details

Date Published: 6 April 2016
PDF: 9 pages
Proc. SPIE 9738, Laser 3D Manufacturing III, 973808 (6 April 2016); doi: 10.1117/12.2214862
Show Author Affiliations
Y. Liu, Univ. of Nebraska-Lincoln (United States)
W. Xiong, Univ. of Nebraska-Lincoln (United States)
Huazhong Univ. of Science and Technology (China)
L. J. Jiang, Univ. of Nebraska-Lincoln (United States)
Y. S. Zhou, Univ. of Nebraska-Lincoln (United States)
Y. F. Lu, Univ. of Nebraska-Lincoln (United States)

Published in SPIE Proceedings Vol. 9738:
Laser 3D Manufacturing III
Bo Gu; Henry Helvajian; Alberto Piqué, Editor(s)

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