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Proceedings Paper

Modeling of defect size distribution in yield forecasting
Author(s): Zhi-Min Ling; Juan Rosal; YungTao Lin; Ying Shiau
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Paper Abstract

The impact of the defect size distribution on yield forecasting is discussed in this work. The fitting parameter p used in traditional defect size distribution modeled at X-p was studied as a function of the process layer and process time. The importance of an accurate on-line defect size measurement is also discussed.

Paper Details

Date Published: 22 September 1995
PDF: 7 pages
Proc. SPIE 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis, (22 September 1995); doi: 10.1117/12.221463
Show Author Affiliations
Zhi-Min Ling, Advanced Micro Devices, Inc. (United States)
Juan Rosal, Advanced Micro Devices, Inc. (United States)
YungTao Lin, Advanced Micro Devices, Inc. (United States)
Ying Shiau, Advanced Micro Devices, Inc. (United States)


Published in SPIE Proceedings Vol. 2635:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis
Gopal Rao; Massimo Piccoli, Editor(s)

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