Share Email Print
cover

Proceedings Paper

Advanced FIB applications for product analysis
Author(s): Andrew Birnie; Andrew Beaumont; Chris Dodd; Grant McNeil
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Focused Ion Beam (FIB) systems have become a workhorse of the modem semiconductor Product Analysis Lab. They have proved invaluable in applications like specific area cross-sectioning for defect identification and process control, for materials analysis sample preparation, for e-beam and mechanical probing preparation and for design debug and fix prototyping. New generation FIB systems, with increased beam current and control have enabled new applications of the tool. This paper aims to discuss these new applications but the data is presented as it was gathered, as a series of case studies, where a particular problem encountered was overcome by innovative use of the FIB.

Paper Details

Date Published: 22 September 1995
PDF: 9 pages
Proc. SPIE 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis, (22 September 1995); doi: 10.1117/12.221448
Show Author Affiliations
Andrew Birnie, Motorola (United States)
Andrew Beaumont, Motorola (United States)
Chris Dodd, Motorola (United States)
Grant McNeil, Motorola (United States)


Published in SPIE Proceedings Vol. 2635:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis
Gopal Rao; Massimo Piccoli, Editor(s)

© SPIE. Terms of Use
Back to Top