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Proceedings Paper

Materials delivery challenges in ULSI processing
Author(s): James F. Loan; Laura A. Sullivan; John J. Sullivan
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Paper Abstract

In the 25-year history of semiconductor device processing never have we experienced such exciting and challenging times as now relative to the materials aspects of deposition processing technology. With each new milestone in the device processing roadmaps comes new and challenging demands on our ability to deposit electromigration barriers, higher conductivity/lower resistivity metal interconnects, dramatically lower dielectric constant interlevel dielectrics, and higher dielectric constant gate oxides. Our ability to achieve success in these areas is dependent on the cleanliness, performance, and reliability of the materials delivery methods chosen to perform that task.

Paper Details

Date Published: 19 September 1995
PDF: 14 pages
Proc. SPIE 2637, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing, (19 September 1995); doi: 10.1117/12.221326
Show Author Affiliations
James F. Loan, MKS Instruments, Inc. (United States)
Laura A. Sullivan, MKS Instruments, Inc. (United States)
John J. Sullivan, MKS Instruments, Inc. (United States)

Published in SPIE Proceedings Vol. 2637:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing
Anant G. Sabnis; Ivo J. Raaijmakers, Editor(s)

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