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Proceedings Paper

Effect of sputtering target crystallographic orientation on step coverage and collimation efficiency
Author(s): Robert S. Bailey; Nicholas C. Hill
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Paper Abstract

The crystallographic orientation of aluminum and titanium planar sputtering targets is shown to influence via bottom coverage and collimation efficiency. A model is developed for predicting the transmission of sputtered atoms through a collimator, based on the measured crystallographic orientation distribution function (ODF). Experimental sputtering results are found to agree with the simulation results. Monte Carlo simulation of step coverage is performed using the angularly resolved sputtering yields derived from the ODF. Improvements in via bottom coverage, greater than 100% (relative), are observed for different crystallographic orientations. The combined effects of crystallographic orientation, target erosion profile, and gas pressure are discussed.

Paper Details

Date Published: 19 September 1995
PDF: 9 pages
Proc. SPIE 2637, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing, (19 September 1995); doi: 10.1117/12.221318
Show Author Affiliations
Robert S. Bailey, Tosoh SMD, Inc. (United States)
Nicholas C. Hill, Tosoh SMD, Inc. (United States)

Published in SPIE Proceedings Vol. 2637:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing
Anant G. Sabnis; Ivo J. Raaijmakers, Editor(s)

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