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Proceedings Paper

3DuV: a MEMS 3D visualization package
Author(s): Nanping R. Lo; Kristofer S. J. Pister
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Paper Abstract

A 3D color graphics visualization package has been developed for MEMS design. The package takes input in CIF format and translates the 2D layout information into a 3D rendering of the design. The user can pan, zoom, and rotate the entire design, or select any individual object and translate, rotate, or scale it. 3Dmicrometers V allows interactive assembly and 3D modeling of hinged, out-of-plane structures. It is particularly useful when interacting parts need to be modeled. A kinematic modeler (collision detection and simulation) has been incorporated into the package. The user can easily manipulate parts and assembly structures, determine clearances, and check for design errors and unexpected inconsistences. Processes supported currently are two-poly/two-sacrificial surface processes (such as the process offered by MCNC in the US), and high aspect ratio processes such as LIGA. Depending on process complexity, new processes can be added to the system with very little effort. As a part of the UCLA MEMS synthesis and analysis CAD toolset, 3Dmicrometers V is public domain, and is available by anonynous FTP from 3Dmicrometers V weas developed on a Sun Sparcstation and written in C with X11R5 Xt and PHIGS-SI graphics library.

Paper Details

Date Published: 15 September 1995
PDF: 6 pages
Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); doi: 10.1117/12.221181
Show Author Affiliations
Nanping R. Lo, Univ. of California/Los Angeles (United States)
Kristofer S. J. Pister, Univ. of California/Los Angeles (United States)

Published in SPIE Proceedings Vol. 2642:
Micromachined Devices and Components
Ray M. Roop; Kevin H. Chau, Editor(s)

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