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Proceedings Paper

Fabrication of micromirror supported by electroplated nickel posts
Author(s): Jong-Woo Shin; Seok-Whan Chung; Yong-Kweon Kim; Eun-Ho Lee; Beom-Gyu Choi; Se-Jin Ahn
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Paper Abstract

A 100 X 100 micrometers 2 aluminum micromirror is designed and fabricated using a thick photoresist as a sacrificial layer and as a mold for nickel electroplating. The micromirror is composed of aluminum mirror plate, two nickel support posts, two aluminum hinges, and two address electrodes. The aluminum mirror plate, which is suppoorted by two nickel support posts, is overhung about 10 micrometers from the silicon substrate. We use thick photoresist to obtain 10 micrometers thick sacrificial layer and electroplate nickel to obtian 10 micrometers height support post. The aluminum mirror plate is actuated like a seesaw by electrostatic force generated by electrostatic potential difference applied between the mirror plate and the address electrode. We use reactive ion etching to release the micromirror plate from the silicon substrate. The edge of the mirror plate landed on the substrate (maximum deflection) when the potential difference between the mirror plate and the address electrode was 35 volts, and the mirror was released from the substrate when the potential difference reduced to 22 volts.

Paper Details

Date Published: 13 September 1995
PDF: 8 pages
Proc. SPIE 2641, Microelectronic Structures and Microelectromechanical Devices for Optical Processing and Multimedia Applications, (13 September 1995); doi: 10.1117/12.220928
Show Author Affiliations
Jong-Woo Shin, Seoul National Univ. (South Korea)
Seok-Whan Chung, Seoul National Univ. (South Korea)
Yong-Kweon Kim, Seoul National Univ. (South Korea)
Eun-Ho Lee, National Industry Technology Institute (South Korea)
Beom-Gyu Choi, Seoul National Univ. (South Korea)
Se-Jin Ahn, Samsung Electronics Co., Ltd. (South Korea)

Published in SPIE Proceedings Vol. 2641:
Microelectronic Structures and Microelectromechanical Devices for Optical Processing and Multimedia Applications
Wayne Bailey; M. Edward Motamedi; Fang-Chen Luo, Editor(s)

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