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Proceedings Paper

Packaging of fiber lasers and components for use in harsh environments
Author(s): Daniel Creeden; Benjamin R. Johnson; Casey Jones; Charles Ibach; Michael Lemons; Peter A. Budni; James P. Zona; Adam Marcinuk; Chris Willis; James Sweeney; Scott D. Setzler
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Paper Abstract

High power continuous and pulsed fiber lasers and amplifiers have become more prevalent in laser systems over the last ten years. In fielding such systems, strong environmental and operational factors drive the packaging of the components. These include large operational temperature ranges, non-standard wavelengths of operation, strong vibration, and lack of water cooling. Typical commercial fiber components are not designed to survive these types of environments. Based on these constraints, we have had to develop and test a wide range of customized fiber-based components and systems to survive in these conditions. In this paper, we discuss some of those designs and detail the testing performed on those systems and components. This includes the use of commercial off-the-shelf (COTS) components, modified to survive extended temperature ranges, as well as customized components designed specifically for performance in harsh environments. Some of these custom components include: ruggedized/monolithic fiber spools; detachable and repeatable fiber collimators; low loss fiber-to-fiber coupling schemes; and high power fiber-coupled isolators.

Paper Details

Date Published: 22 April 2016
PDF: 7 pages
Proc. SPIE 9730, Components and Packaging for Laser Systems II, 973013 (22 April 2016); doi: 10.1117/12.2209101
Show Author Affiliations
Daniel Creeden, BAE Systems (United States)
Benjamin R. Johnson, BAE Systems (United States)
Casey Jones, BAE Systems (United States)
Charles Ibach, BAE Systems (United States)
Michael Lemons, BAE Systems (United States)
Peter A. Budni, BAE Systems (United States)
James P. Zona, BAE Systems (United States)
Adam Marcinuk, BAE Systems (United States)
Chris Willis, BAE Systems (United States)
James Sweeney, BAE Systems (United States)
Scott D. Setzler, BAE Systems (United States)

Published in SPIE Proceedings Vol. 9730:
Components and Packaging for Laser Systems II
Alexei L. Glebov; Paul O. Leisher, Editor(s)

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