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Proceedings Paper

Low-temperature bonded glass-membrane microfluidic device for in vitro organ-on-a-chip cell culture models
Author(s): Kyall J. Pocock; Xiaofang Gao; Chenxi Wang; Craig Priest; Clive A. Prestidge; Kazuma Mawatari; Takehiko Kitamori; Benjamin Thierry
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Paper Abstract

The integration of microfluidics with living biological systems has paved the way to the exciting concept of “organson- a-chip”, which aims at the development of advanced in vitro models that replicate the key features of human organs. Glass based devices have long been utilised in the field of microfluidics but the integration of alternative functional elements within multi-layered glass microdevices, such as polymeric membranes, remains a challenge.
To this end, we have extended a previously reported approach for the low-temperature bonding of glass devices that enables the integration of a functional polycarbonate porous membrane. The process was initially developed and optimised on specialty low-temperature bonding equipment (μTAS2001, Bondtech, Japan) and subsequently adapted to more widely accessible hot embosser units (EVG520HE Hot Embosser, EVG, Austria). The key aspect of this method is the use of low temperatures compatible with polymeric membranes. Compared to borosilicate glass bonding (650 °C) and quartz/fused silica bonding (1050 °C) processes, this method maintains the integrity and functionality of the membrane (Tg 150 °C for polycarbonate). Leak tests performed showed no damage or loss of integrity of the membrane for up to 150 hours, indicating sufficient bond strength for long term cell culture. A feasibility study confirmed the growth of dense and functional monolayers of Caco-2 cells within 5 days.

Paper Details

Date Published: 22 December 2015
PDF: 9 pages
Proc. SPIE 9668, Micro+Nano Materials, Devices, and Systems, 96680W (22 December 2015); doi: 10.1117/12.2202461
Show Author Affiliations
Kyall J. Pocock, Univ. of South Australia (Australia)
Xiaofang Gao, The Univ. of Tokyo (Japan)
Chenxi Wang, Harbin Institute of Technology (China)
Craig Priest, Univ. of South Australia (Australia)
Clive A. Prestidge, Univ. of South Australia (Australia)
Kazuma Mawatari, The Univ. of Tokyo (Japan)
Takehiko Kitamori, The Univ. of Tokyo (Japan)
Benjamin Thierry, Univ. of South Australia (Australia)

Published in SPIE Proceedings Vol. 9668:
Micro+Nano Materials, Devices, and Systems
Benjamin J. Eggleton; Stefano Palomba, Editor(s)

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