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Proceedings Paper

Mask blank defect printability comparison using optical and SEM mask and wafer inspection and bright field actinic mask imaging
Author(s): Pawitter Mangat; Erik Verduijn; Obert R. Wood II; Markus P. Benk; Antoine Wojdyla; Kenneth A. Goldberg
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Paper Abstract

Despite significant enhancements in defect detection using optical and e-beam methodology, the smaller length scales and increasing challenges of future technology nodes motivate ongoing research into the need and associated cost of actinic inspection for EUV masks. This paper reports an extensive study of two EUV patterned masks, wherein the mask blank defectivity was characterized using optical (mask and wafer) methods and bright-field mask imaging (using the SHARP actinic microscope) of previously identified blank defects. We find that the bright field actinic imaging tool microscope captures and images many defects that are not seen by the automated optical inspection of patterned masks and printed wafers. In addition, actinic review reveals the impact of multilayer damage and depicts the printability profile which can be used as an added metric to define the patterned mask repair and defect compensation strategies.

Paper Details

Date Published: 9 July 2015
PDF: 8 pages
Proc. SPIE 9658, Photomask Japan 2015: Photomask and Next-Generation Lithography Mask Technology XXII, 96580E (9 July 2015); doi: 10.1117/12.2201048
Show Author Affiliations
Pawitter Mangat, GLOBALFOUNDRIES Inc. (United States)
Erik Verduijn, GLOBALFOUNDRIES Inc. (United States)
Obert R. Wood II, GLOBALFOUNDRIES Inc. (United States)
Markus P. Benk, Lawrence Berkeley National Lab. (United States)
Antoine Wojdyla, Lawrence Berkeley National Lab. (United States)
Kenneth A. Goldberg, Lawrence Berkeley National Lab. (United States)

Published in SPIE Proceedings Vol. 9658:
Photomask Japan 2015: Photomask and Next-Generation Lithography Mask Technology XXII
Nobuyuki Yoshioka, Editor(s)

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