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Proceedings Paper

Microsystem integration from RF to millimeter wave applications
Author(s): T. Vähä-Heikkilä; M. Lahti
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Paper Abstract

Radio frequency systems have been applied successfully to consumer products. Typically these radios operate up to 6 GHz. During recent years, interest towards microwave (up to 30 GHz) and millimeter wave frequencies (30 ... 300 GHz) has increased significantly. Technologies have been developed to have high performance microwave and millimeter wave components. On the other hand, integration and packaging technologies have not developed as fast while their importance is crucial especially in consumer applications. This presentation focuses to latest trends in wireless microsystem component integration and packaging trends backed up with demonstrators and measured results based on VTT’s demonstrations.

Paper Details

Date Published: 15 June 2015
PDF: 8 pages
Proc. SPIE 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, 95170R (15 June 2015); doi: 10.1117/12.2180864
Show Author Affiliations
T. Vähä-Heikkilä, VTT Technical Research Ctr. of Finland (Finland)
M. Lahti, VTT Technical Research Ctr. of Finland (Finland)

Published in SPIE Proceedings Vol. 9517:
Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems
José Luis Sánchez-Rojas; Riccardo Brama, Editor(s)

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