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Proceedings Paper

Acoustic high-frequency effects inside the package of capacitive silicon microphones and their impact on the device performance
Author(s): G. Schrag; T. Kuenzig; D. Pham; C. Glacer; A. Dehé; G. Wachutka
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Paper Abstract

We present investigations on acoustic effects occurring inside the sound port of capacitive silicon microphones, which exert additional frequency-dependent damping forces on the sensing membrane and, thus, affect the overall performance of the microphone. Extensive FE simulations have been carried out in order to study the airflow inside the package, to identify relevant impact factors, and to optimize an existing acoustic network model intended for implementation in a fully coupled, multi-energy domain system-level model of the device.

Paper Details

Date Published: 21 May 2015
PDF: 7 pages
Proc. SPIE 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, 95170M (21 May 2015); doi: 10.1117/12.2179888
Show Author Affiliations
G. Schrag, Technische Univ. München (Germany)
T. Kuenzig, Technische Univ. München (Germany)
D. Pham, Technische Univ. München (Germany)
Infineon Technologies AG (Germany)
C. Glacer, Infineon Technologies AG (Germany)
A. Dehé, Infineon Technologies AG (Germany)
G. Wachutka, Technische Univ. München (Germany)

Published in SPIE Proceedings Vol. 9517:
Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems
José Luis Sánchez-Rojas; Riccardo Brama, Editor(s)

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