Proceedings Paper
Confocal Raman spectroscopy and AFM for evaluation of sidewalls in type II superlattice FPAs| Format | Member Price | Non-Member Price |
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Paper Abstract
We propose to utilize confocal Raman spectroscopy combined with high resolution atomic force microscopy (AFM) for nondestructive characterisation of the sidewalls of etched and passivated small pixel (24 μm×24 μm) focal plane arrays (FPA) fabricated using LW/LWIR InAs/GaSb type-II strained layer superlattice (T2SL) detector material. Special high aspect ratio Si and GaAs AFM probes, with tip length of 13 μm and tip aperture less than 7°, allow characterisation of the sidewall morphology. Confocal microscopy enables imaging of the sidewall profile through optical sectioning. Raman spectra measured on etched T2SL FPA single pixels enable us to quantify the non-uniformity of the mesa delineation process.
Paper Details
Date Published: 4 June 2015
PDF: 12 pages
Proc. SPIE 9451, Infrared Technology and Applications XLI, 94510R (4 June 2015); doi: 10.1117/12.2178162
Published in SPIE Proceedings Vol. 9451:
Infrared Technology and Applications XLI
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton, Editor(s)
PDF: 12 pages
Proc. SPIE 9451, Infrared Technology and Applications XLI, 94510R (4 June 2015); doi: 10.1117/12.2178162
Show Author Affiliations
T. J. Rotter, Actoprobe LLC (United States)
T. Busani, Actoprobe LLC (United States)
P. Rathi, Actoprobe LLC (United States)
F. Jaeckel, Actoprobe LLC (United States)
P. A. Reyes, Actoprobe LLC (United States)
K. J. Malloy, Actoprobe LLC (United States)
A. A. Ukhanov, Actoprobe LLC (United States)
T. Busani, Actoprobe LLC (United States)
P. Rathi, Actoprobe LLC (United States)
F. Jaeckel, Actoprobe LLC (United States)
P. A. Reyes, Actoprobe LLC (United States)
K. J. Malloy, Actoprobe LLC (United States)
A. A. Ukhanov, Actoprobe LLC (United States)
E. Plis, Skinfrared LLC (United States)
S. Krishna, SKINfrared LLC (United States)
M. Jaime-Vasquez, U.S. Army RDECOM CERDEC NVESD (United States)
N. F. Baril, U.S. Army RDECOM CERDEC NVESD (United States)
J. D. Benson, U.S. Army RDECOM CERDEC NVESD (United States)
D. A. Tenne, Boise State Univ. (United States)
S. Krishna, SKINfrared LLC (United States)
M. Jaime-Vasquez, U.S. Army RDECOM CERDEC NVESD (United States)
N. F. Baril, U.S. Army RDECOM CERDEC NVESD (United States)
J. D. Benson, U.S. Army RDECOM CERDEC NVESD (United States)
D. A. Tenne, Boise State Univ. (United States)
Published in SPIE Proceedings Vol. 9451:
Infrared Technology and Applications XLI
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton, Editor(s)
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