The assurance of the integrity of adhesive bonding at substrate interfaces is paramount to the longevity and sustainability of encapsulated components. Unfortunately, it is often difficult to non-destructively evaluate these materials to determine the adequacy of bonding after manufacturing and then later in service. A particularly difficult problem in this regard is the reliable detection/monitoring of regions of weak bonding that may result from poor adhesion or poor cohesive strength, or degradation in service. One promising and perhaps less explored avenue we have recently begun to investigate for this purpose centers on the use of (chirped) fiber Bragg grating sensing technology. In this scenario, a grating is patterned into a fiber optic such that a (broadband) spectral reflectance is observed. The sensor is highly sensitive to local and uniform changes across the length of the grating. Initial efforts to evaluate this approach for measuring adhesive bonding defects at substrate interfaces are discussed. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-AC04-94AL85000.

Date Published: 13 May 2015
PDF: 11 pages
Proc. SPIE 9480, Fiber Optic Sensors and Applications XII, 948007 (13 May 2015); doi: 10.1117/12.2177701

Published in SPIE Proceedings Vol. 9480:
Fiber Optic Sensors and Applications XII
Gary Pickrell; Eric Udd; Henry H. Du, Editor(s)