Proceedings Paper
Test pixels for high-temperature infrared scene projection| Format | Member Price | Non-Member Price |
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Paper Abstract
High pixel temperatures for IR scene projector arrays face materials challenges of oxidation, diffusion, and recrystallization. For cost effective development of new high-temperature materials, we have designed and fabricated simplified pixels for testing. These consist of resistive elements, traces, and bond pads sandwiched between dielectric layers on Si wafers. Processing involves a pad exposure etch, a pixel outline etch, and an undercut etch to thermally isolate the resistive element from the substrate. Test pixels were successfully fabricated by electron-beam lithography using a combination of wet and dry etching.
Paper Details
Date Published: 12 May 2015
PDF: 6 pages
Proc. SPIE 9452, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVI, 94520X (12 May 2015); doi: 10.1117/12.2177025
Published in SPIE Proceedings Vol. 9452:
Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVI
Gerald C. Holst; Keith A. Krapels, Editor(s)
PDF: 6 pages
Proc. SPIE 9452, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVI, 94520X (12 May 2015); doi: 10.1117/12.2177025
Show Author Affiliations
Christopher J. Fredricksen, LRC Engineering, Inc. (United States)
Seth Calhoun, Univ. of Central Florida (United States)
Stephen Trewick, Univ. of Central Florida (United States)
Aubrey Coffey, Univ. of Central Florida (United States)
Edward Dein, Univ. of Central Florida (United States)
Kevin R. Coffey, Univ. of Central Florida (United States)
Seth Calhoun, Univ. of Central Florida (United States)
Stephen Trewick, Univ. of Central Florida (United States)
Aubrey Coffey, Univ. of Central Florida (United States)
Edward Dein, Univ. of Central Florida (United States)
Kevin R. Coffey, Univ. of Central Florida (United States)
Robert E. Peale, Univ. of Central Florida (United States)
Joseph D. LaVeigne, Santa Barbara Infrared, Inc. (United States)
Gregory Franks, Santa Barbara Infrared, Inc. (United States)
Tom Danielson, Santa Barbara Infrared, Inc. (United States)
John M. Lannon Jr., RTI International (United States)
Scott H. Goodwin, RTI International (United States)
Joseph D. LaVeigne, Santa Barbara Infrared, Inc. (United States)
Gregory Franks, Santa Barbara Infrared, Inc. (United States)
Tom Danielson, Santa Barbara Infrared, Inc. (United States)
John M. Lannon Jr., RTI International (United States)
Scott H. Goodwin, RTI International (United States)
Published in SPIE Proceedings Vol. 9452:
Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVI
Gerald C. Holst; Keith A. Krapels, Editor(s)
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