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Proceedings Paper

Massively parallel E-beam inspection: enabling next-generation patterned defect inspection for wafer and mask manufacturing
Author(s): Matt Malloy; Brad Thiel; Benjamin D. Bunday; Stefan Wurm; Maseeh Mukhtar; Kathy Quoi; Thomas Kemen; Dirk Zeidler; Anna Lena Eberle; Tomasz Garbowski; Gregor Dellemann; Jan Hendrik Peters
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Paper Abstract

SEMATECH aims to identify and enable disruptive technologies to meet the ever-increasing demands of semiconductor high volume manufacturing (HVM). As such, a program was initiated in 2012 focused on high-speed e-beam defect inspection as a complement, and eventual successor, to bright field optical patterned defect inspection [1]. The primary goal is to enable a new technology to overcome the key gaps that are limiting modern day inspection in the fab; primarily, throughput and sensitivity to detect ultra-small critical defects. The program specifically targets revolutionary solutions based on massively parallel e-beam technologies, as opposed to incremental improvements to existing e-beam and optical inspection platforms. Wafer inspection is the primary target, but attention is also being paid to next generation mask inspection. During the first phase of the multi-year program multiple technologies were reviewed, a down-selection was made to the top candidates, and evaluations began on proof of concept systems. A champion technology has been selected and as of late 2014 the program has begun to move into the core technology maturation phase in order to enable eventual commercialization of an HVM system. Performance data from early proof of concept systems will be shown along with roadmaps to achieving HVM performance. SEMATECH’s vision for moving from early-stage development to commercialization will be shown, including plans for development with industry leading technology providers.

Paper Details

Date Published: 19 March 2015
PDF: 10 pages
Proc. SPIE 9423, Alternative Lithographic Technologies VII, 942319 (19 March 2015); doi: 10.1117/12.2175535
Show Author Affiliations
Matt Malloy, SEMATECH Inc. (United States)
Brad Thiel, SUNY Polytechnic Institute (United States)
Benjamin D. Bunday, SEMATECH Inc. (United States)
Stefan Wurm, SEMATECH Inc. (United States)
Maseeh Mukhtar, SUNY Polytechnic Institute (United States)
Kathy Quoi, SUNY Polytechnic Institute (United States)
Thomas Kemen, Carl Zeiss Microscopy GmbH (Germany)
Dirk Zeidler, Carl Zeiss Microscopy GmbH (Germany)
Anna Lena Eberle, Carl Zeiss Microscopy GmbH (Germany)
Tomasz Garbowski, Carl Zeiss Microscopy GmbH (Germany)
Gregor Dellemann, Carl Zeiss Microscopy GmbH (Germany)
Jan Hendrik Peters, Carl Zeiss Microscopy GmbH (Germany)

Published in SPIE Proceedings Vol. 9423:
Alternative Lithographic Technologies VII
Douglas J. Resnick; Christopher Bencher, Editor(s)

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