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Proceedings Paper

One-point wafer bonding for highly accurate x-ray masks
Author(s): Masatoshi Oda; Takashi Ohkubo; Hideo Yoshihara
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Paper Abstract

We have proposed a new method of bonding Si wafers to glass frames for highly accurate X-ray masks. The method, called one-point bonding, is characterized by bonding the wafer at a very small area on the outer region of the wafer and floating the wafer over the frame except at the bonding area. This construction frees the wafer from any external force that acts on the frame. We found that this bonding method does not cause deformation of the wafer or pattern placement shifts in the membrane. The bonding of a 4-mm-diameter glued area is strong enough to withstand a vertical load of 150 g, therefore, wafers bonded to the frame by this method are not peeled off during mask handling. We have confirmed that no deformations occur in wafers bonded by this method even if the frame is deformed in a stepper.

Paper Details

Date Published: 3 July 1995
PDF: 8 pages
Proc. SPIE 2512, Photomask and X-Ray Mask Technology II, (3 July 1995); doi: 10.1117/12.212772
Show Author Affiliations
Masatoshi Oda, NTT Advanced Technology Corp. (Japan)
Takashi Ohkubo, NTT Advanced Technology Corp. (Japan)
Hideo Yoshihara, NTT Advanced Technology Corp. (Japan)

Published in SPIE Proceedings Vol. 2512:
Photomask and X-Ray Mask Technology II
Hideo Yoshihara, Editor(s)

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