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Proceedings Paper

Lithographic performance of a positive photoresist for thick-film applications
Author(s): Alfred F. Renaldo; Laurie J. Lauchlan; Donald C. Hofer; William D. Hinsberg; Dennis R. McKean; Hugo A.E. Santini; C. Grant Willson
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Paper Abstract

The process capability of a commercially available positive diazonaphthoquinone (DNQ) photoresist, SJR 3000 series from Shipley, was evaluated. This photoresist at a film thickness of 7 - 8 microns was found to have a large process latitude and focus budget while maintaining nearly vertical wall profiles. The high contrast found with this thick film photoresist was due to a low loading of a monofunctional DNQ sensitizer which also has a high dissolution inhibition. The photoresist formulation was compatible with both AZ 400K and Microposit (MP) 2401 developers when using either a stepper or scanner exposure system. SJR photoresist was shown to provide an effective photoresist frame for electroplating metals such as copper and permalloy.

Paper Details

Date Published: 9 June 1995
PDF: 14 pages
Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995);
Show Author Affiliations
Alfred F. Renaldo, IBM Corp. (United States)
Laurie J. Lauchlan, IBM Corp. (United States)
Donald C. Hofer, IBM Almaden Research Ctr. (United States)
William D. Hinsberg, IBM Almaden Research Ctr. (United States)
Dennis R. McKean, IBM Almaden Research Ctr. (United States)
Hugo A.E. Santini, IBM Almaden Research Ctr. (United States)
C. Grant Willson, Univ. of Texas/Austin (United States)

Published in SPIE Proceedings Vol. 2438:
Advances in Resist Technology and Processing XII
Robert D. Allen, Editor(s)

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