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Proceedings Paper

Unique spin coat process for positive photoresists
Author(s): Dan Lyons; Bernard T. Beauchemin Jr.; Susan Garrard
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Paper Abstract

A unique spin coat process was developed which improves the coating uniformity and extends the range of applicable resist thicknesses typically encountered for a one viscosity photoresist. This spin coat process involves a high speed, short term initial coat followed by a low speed dry cycle. Advantages are seen in better standard deviation of coating uniformity and coating thicknesses achieved over a 1 micron range (1.2 to 2.4 microns) for positive photoresists on 6' wafers. In this paper the authors discuss the application of this unique resist processing approach to three types of photoresists which differ in solvent composition (utilizing ethyl lactate, propylene glycol mono methyl ether acetate, and 3-ethoxy-ethyl propionate). Comparison of coating uniformity at various resist thicknesses with a standard coating process is made and emphasis is placed on analysis of residual solvent and PAC content in resist films.

Paper Details

Date Published: 9 June 1995
PDF: 11 pages
Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); doi: 10.1117/12.210409
Show Author Affiliations
Dan Lyons, OCG Microelectronic Materials, Inc. (United States)
Bernard T. Beauchemin Jr., OCG Microelectronic Materials, Inc. (United States)
Susan Garrard, National Semiconductor Corp. (United States)

Published in SPIE Proceedings Vol. 2438:
Advances in Resist Technology and Processing XII
Robert D. Allen, Editor(s)

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