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Proceedings Paper

Shot-size reduction of photoresist formulations
Author(s): Wayne M. Moreau; Kathleen M. Cornett; James T. Fahey; Leo L. Linehan; Warren Montgomery; Marina V. Plat; Randolph S. Smith; Robert L. Wood
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Paper Abstract

The cost of expendable chemicals in the resist process is increasing and with this the economic impetus to conserve usage. The volume of liquid resist dispensed (shot size) determines the consumption rate and disposal volumes of liquid resist. The choice of resist solvent can influence the shot volume. Three formulation factors influence the shot size: (1) the surface tension of the resist and the interfacial energy of the coating surface, (2) the viscosity of the resist formulation, and (3) the evaporation rate of the solvent. The suitable resist formulation and subsequent solvent choice should be of the lowest surface tension and lowest viscosity and be balanced by an evaporation rate which allows a minimum shot volume to be spread on the surface without significant solvent loss. Of all the solvents examined, ethyl 3-ethoxy propionate (EEP) gave the lowest shot size relative to the old resist solvent standard of 2- ethoxy ethyl acetate (ECA).

Paper Details

Date Published: 9 June 1995
PDF: 13 pages
Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); doi: 10.1117/12.210363
Show Author Affiliations
Wayne M. Moreau, IBM Corp. (United States)
Kathleen M. Cornett, IBM Corp. (United States)
James T. Fahey, IBM Corp. (United States)
Leo L. Linehan, IBM Corp. (United States)
Warren Montgomery, IBM Corp. (United States)
Marina V. Plat, IBM Corp. (United States)
Randolph S. Smith, IBM Corp. (United States)
Robert L. Wood, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 2438:
Advances in Resist Technology and Processing XII
Robert D. Allen, Editor(s)

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