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Proceedings Paper

High-density 18-channel fiber optic avionics connector
Author(s): Christopher A. Roe
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Paper Abstract

The Avionics Multifiber Array Connector, AVMAC, is an optical connecting device that utilizes circular connector technology with MACII technology to align 18 channel fiber optic ribbon cable. There presently is no inexpensive avionic or military grade high-density fiber optic connector. The AVMAC connector will use a ruggedized MACII v-groove alignment array enclosed in a circular protective housing. This contact assembly will be rear insertable into and removable for a MIL-C-83723 connector. A MIL-C-83723 connector incorporating a special insert will be the initial testbed. However, with small modifications to the basic design, a multitude of different circular and rack-in-panel connectors might be used. The AVMAC connector offers a gang terminated 18 channel fiber optic interconnection all within a very small footprint of approximately 0.5 inch in diameter, and is designed to be installable through 0.5 inch conduit. The design hurdles are: (1) developing a new polishing technique to prevent intimate contact of the fiber faces to prevent cracking during extreme vibration and shock, (2) selection of an adhesive and cure schedule development to handle the extreme temperature requirements, and (3) in general, material and process development in order to ruggedize the design to survive the harsh environment and performance requirements of an avionic and possibly military application. A preliminary design of the AVMAC connector has been completed and a prototype model built. This model is currently undergoing vibration and optical performance testing. The AVMAC connector is scheduled to be finalized and fully qualifiable by end of 1995 as part of the FLASH (Fly-by-Light Advanced System Hardware) contract.

Paper Details

Date Published: 22 May 1995
PDF: 8 pages
Proc. SPIE 2467, Fly-by-Light: Technology Transfer, (22 May 1995); doi: 10.1117/12.210075
Show Author Affiliations
Christopher A. Roe, Berg Electronics (United States)

Published in SPIE Proceedings Vol. 2467:
Fly-by-Light: Technology Transfer
Daniel B. Thompson; Robert J. Baumbick; Larry B. Stotts, Editor(s)

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