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Proceedings Paper

Multichip interconnect technique for optoelectronic components
Author(s): Chang Lee Chen; Len J. Mahoney; Dean Z. Tsang; K. M. Molvar; Scott P. Doran; Vicky Diadiuk
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Paper Abstract

Consideration is given to a multichip interconnect approach representing a new packaging technique that eliminates drawbacks of a conventional hybrid circuit and avoids difficult technologies required for a fully monolithic circuit. The process is considered to be simple, and mass production is considered to be feasible with some automation. Since no constraints are imposed on the chips used, any commercially available device or circuits can be packaged using this technique.

Paper Details

Date Published: 1 October 1990
PDF: 8 pages
Proc. SPIE 1291, Optical and Digital Gallium Arsenide Technologies for Signal Processing Applications, (1 October 1990); doi: 10.1117/12.20998
Show Author Affiliations
Chang Lee Chen, Lincoln Lab./MIT (United States)
Len J. Mahoney, Lincoln Lab./MIT (United States)
Dean Z. Tsang, Lincoln Lab./MIT (United States)
K. M. Molvar, Lincoln Lab./MIT (United States)
Scott P. Doran, Lincoln Lab./MIT (United States)
Vicky Diadiuk, Lincoln Lab./MIT (United States)

Published in SPIE Proceedings Vol. 1291:
Optical and Digital Gallium Arsenide Technologies for Signal Processing Applications
Mark P. Bendett; Daniel H. Butler Jr.; Arati Prabhakar; Andrew C. Yang, Editor(s)

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