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Proceedings Paper

Extendibility of laser scanning tools for advanced wafer inspection
Author(s): Brian M. Trafas; Mehrdad Nikoonahad; Keith B. Wells; R. Johnson; Stanley E. Stokowski
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Paper Abstract

This paper describes a broad range of design issues that influence the performance of optical equipment for in-line inspection of random (logic) and repetitive (memory) patterns. In particular, we describe the angular distribution of signals from defects on a patterned wafer illuminated by a focused optical beam. We analyze the configuration of both illumination and collection optics to maximize the signal to background ratio for the detection of submicron defects on pattern. In addition, we analyze the distribution of the scattered light as a function of pattern periodicity and orientation with respect to the illuminating beam. The advantages of polarization selection and spatial filtering techniques are explored to enhance the detection sensitivity on repetitive and random pattern wafers. From these results we have developed a new patterned wafer inspection system that offers increased sensitivity and improved defect capture.

Paper Details

Date Published: 22 May 1995
PDF: 10 pages
Proc. SPIE 2439, Integrated Circuit Metrology, Inspection, and Process Control IX, (22 May 1995); doi: 10.1117/12.209199
Show Author Affiliations
Brian M. Trafas, Tencor Instruments, Inc. (United States)
Mehrdad Nikoonahad, Tencor Instruments, Inc. (United States)
Keith B. Wells, Tencor Instruments, Inc. (United States)
R. Johnson, Tencor Instruments, Inc. (United States)
Stanley E. Stokowski, Tencor Instruments, Inc. (United States)

Published in SPIE Proceedings Vol. 2439:
Integrated Circuit Metrology, Inspection, and Process Control IX
Marylyn Hoy Bennett, Editor(s)

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