Share Email Print

Proceedings Paper

Magnetron sputtering for the production of EUV mask blanks
Author(s): Patrick Kearney; Tat Ngai; Anil Karumuri; Jung Yum; Hojune Lee; David Gilmer; Tuan Vo; Frank Goodwin
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Ion Beam Deposition (IBD) has been the primary technique used to deposit EUV mask blanks since 1995 when it was discovered it could produce multilayers with few defects. Since that time the IBD technique has been extensively studied and improved and is finally approaching usable defectivities. But in the intervening years, the defectivity of magnetron sputtering has been greatly improved. This paper evaluates the suitability of a modern magnetron tool to produce EUV mask blanks and the ability to support HVM production. In particular we show that the reflectivity and uniformity of these tools are superior to current generation IBD tools, and that the magnetron tools can produce EUV films with defect densities comparable to recent best IBD tool performance. Magnetron tools also offer many advantages in manufacturability and tool throughput; however, challenges remain, including transitioning the magnetron tools from the wafer to mask formats. While work continues on quantifying the capability of magnetron sputtering to meet the mask blank demands of the industry, for the most part the remaining challenges do not require any fundamental improvements to existing technology. Based on the recent results and the data presented in this paper there is a clear indication that magnetron deposition should be considered for the future of EUV mask blank production.

Paper Details

Date Published: 6 April 2015
PDF: 4 pages
Proc. SPIE 9422, Extreme Ultraviolet (EUV) Lithography VI, 94220H (6 April 2015); doi: 10.1117/12.2087773
Show Author Affiliations
Patrick Kearney, SEMATECH Inc. (United States)
Tat Ngai, SEMATECH Inc. (United States)
Anil Karumuri, SEMATECH Inc. (United States)
Jung Yum, SEMATECH Inc. (United States)
Hojune Lee, SEMATECH Inc (United States)
David Gilmer, SEMATECH Inc. (United States)
Tuan Vo, College of Nanoscale Science and Engineering (United States)
Frank Goodwin, SEMATECH Inc. (United States)

Published in SPIE Proceedings Vol. 9422:
Extreme Ultraviolet (EUV) Lithography VI
Obert R. Wood II; Eric M. Panning, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?