Share Email Print

Proceedings Paper

Photoresist performance modification through plasma treatment
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

One of most promising technique for the extension of 193nm immersion lithography must be Self-Aligned Multiple Patterning (SAMP) at the present. We have studied this SAMP in several aspects, which are scaling capability, mitigation of process complexity, pattern fidelity, affordability and so on. On the other hand, Gridded Design Rule (GDR) concept with Single directional layout (1D layout) extended the down-scaling with 193-immersion furthermore and relieve the process variation and process complexity, represented in Optical proximity effect (OPE), by simplification of layout design. In 1D layout fabrication, Key process steps might be edge placement control on grating line and controllability of hole-shrink technique for line-cutting. This paper introduces current demonstration results on pattern transfer fidelity control and hole-shrink technique as combined with unique pattern shape repair approach.

Paper Details

Date Published: 17 March 2015
PDF: 11 pages
Proc. SPIE 9428, Advanced Etch Technology for Nanopatterning IV, 94280H (17 March 2015); doi: 10.1117/12.2085093
Show Author Affiliations
Hidetami Yaegashi, Tokyo Electron Ltd. (Japan)
Kenichi Oyama, Tokyo Electron Ltd. (Japan)
Arisa Hara, Tokyo Electron Ltd. (Japan)
Sakurako Natori, Tokyo Electron Ltd. (Japan)
Shohei Yamauchi, Tokyo Electron Ltd. (Japan)
Masatoshi Yamato, Tokyo Electron Ltd. (Japan)
Noriaki Okabe, Tokyo Electron Ltd. (Japan)
Kyohei Koike, Tokyo Electron Ltd. (Japan)

Published in SPIE Proceedings Vol. 9428:
Advanced Etch Technology for Nanopatterning IV
Qinghuang Lin; Sebastian U. Engelmann; Ying Zhang, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?