Proceedings Paper
Modeling of terahertz metamaterial-sensors for simulation based on effect of resonance induction| Format | Member Price | Non-Member Price |
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Paper Abstract
In order to observe more properties of an electrically resonant metamaterial-sensor, a single cubic unit of the matamaterial-sensor was simulated using the finite-element algorithm and Microwave Studios by CST. Meanwhile, an adaptive mesh refinement was used to ensure an accurate numerical solution with relatively short calculation time. In order to effectively conduct the simulation, some field monitors were also added to help the observation of electromagnetic properties of the unit. Through the electromagnetic simulation, the transmission and reflection spectra of the unit metamaterial-sensor were acquired. At the SRR gap, each kind of metamaterial-sensor structure presents an obvious resonant response at several THz frequency points. Simulation results indicated that the transmission was as low as 0.03 at ~0.79 THz. Other simulation results such as the surface current, the electric field, the electric energy density, and the power loss density, were also observed. By analyzing the simulation results, an idea to obtain the resonant strength in an indirect way was worked out and a way was found to realize the multispectral imaging in THz region.
Paper Details
Date Published: 6 March 2015
PDF: 7 pages
Proc. SPIE 9446, Ninth International Symposium on Precision Engineering Measurement and Instrumentation, 94460D (6 March 2015); doi: 10.1117/12.2084169
Published in SPIE Proceedings Vol. 9446:
Ninth International Symposium on Precision Engineering Measurement and Instrumentation
Junning Cui; Jiubin Tan; Xianfang Wen, Editor(s)
PDF: 7 pages
Proc. SPIE 9446, Ninth International Symposium on Precision Engineering Measurement and Instrumentation, 94460D (6 March 2015); doi: 10.1117/12.2084169
Show Author Affiliations
Yehua Bie, National Key Lab. of Science and Technology on Multispectral Information Processing (China)
Huazhong Univ. of Science and Technology (China)
Jun Luo, National Key Lab. of Science and Technology on Multispectral Information Processing (China)
Huazhong Univ. of Science and Technology (China)
Weijun Li, National Key Lab. of Science and Technology on Multispectral Information Processing (China)
Huazhong Univ. of Science and Technology (China)
Xinyu Zhang, National Key Lab. of Science and Technology on Multispectral Information Processing (China)
Huazhong Univ. of Science and Technology (China)
Huazhong Univ. of Science and Technology (China)
Jun Luo, National Key Lab. of Science and Technology on Multispectral Information Processing (China)
Huazhong Univ. of Science and Technology (China)
Weijun Li, National Key Lab. of Science and Technology on Multispectral Information Processing (China)
Huazhong Univ. of Science and Technology (China)
Xinyu Zhang, National Key Lab. of Science and Technology on Multispectral Information Processing (China)
Huazhong Univ. of Science and Technology (China)
An Ji, Institute of Semiconductors (China)
Hongshi Sang, National Key Lab. of Science and Technology on Multispectral Information Processing (China)
Changsheng Xie, Huazhong Univ. of Science and Technology (China)
Hongshi Sang, National Key Lab. of Science and Technology on Multispectral Information Processing (China)
Changsheng Xie, Huazhong Univ. of Science and Technology (China)
Published in SPIE Proceedings Vol. 9446:
Ninth International Symposium on Precision Engineering Measurement and Instrumentation
Junning Cui; Jiubin Tan; Xianfang Wen, Editor(s)
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