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Proceedings Paper

Wide spectral band beam analysis
Author(s): Oren Aharon
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Paper Abstract

The reality in laser beam profiling is that measurements are performed over a wide spectrum of wavelengths and power ranges. Many applications use multiple laser wavelengths with very different power levels, a fact which dictates a need for a better measuring tool. Rapid progress in the fiber laser area has increased the demand for lasers in the wavelength range of 900 - 1030 nm, while the telecommunication market has increased the demand for wavelength range of 1300nm - 1600 nm, on the other hand the silicone chip manufacturing and mass production requirements tend to lower the laser wavelength towards the 190nm region. In many cases there is a need to combine several lasers together in order to perform a specific task. A typical application is to combine one visible laser for pointing, with a different laser for material processing with a very different wavelength and power level. The visible laser enables accurate pointing before the second laser is operated. The beam profile of the intensity distribution is an important parameter that indicates how a laser beam will behave in an application. Currently a lab, where many different lasers are used, will find itself using various laser beam profilers from several vendors with different specifications and accuracies. It is the propose of this article to present a technological breakthrough in the area of detectors, electronics and optics allowing intricate measurements of lasers with different wavelength and with power levels that vary many orders of magnitude by a single beam profiler.

Paper Details

Date Published: 9 March 2015
PDF: 6 pages
Proc. SPIE 9356, High-Power Laser Materials Processing: Lasers, Beam Delivery, Diagnostics, and Applications IV, 93560S (9 March 2015); doi: 10.1117/12.2084072
Show Author Affiliations
Oren Aharon, Duma Optronics Ltd. (Israel)


Published in SPIE Proceedings Vol. 9356:
High-Power Laser Materials Processing: Lasers, Beam Delivery, Diagnostics, and Applications IV
Friedhelm Dorsch, Editor(s)

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