The ultrafast laser polishing technology is a new surface processing technology in recent years. Because this technology has the characteristics of the polishing quality and less heat effect, it is very suitable for high precision polishing for hard brittle materials. This paper from the ultrafast laser polishing system structures, experimental design, and data analysis, etc., studies the ultrafast laser polishing principle and processing technology of single crystal silicon. In the experiment, the system with femtosecond laser (λ=515nm, f=4kHz) and picosecond laser (λ=532nm, f=200kHz) polishing materials, after processing, system using digital microscope and surface profiler tests the surface roughness and surface morphology of the region. This paper analyzes the laser energy density, the spot overlap and scanning mode for ultrafast laser polishing quality. The orthogonal experiment design can be clearly analyzes the importance of factors are in polishing effect. And the single factor experiment design can be clearly analyzes the parameter level changes on the polishing effect. Combining with two methods of experiment, parameters can be optimized scientifically and comprehensively.

Date Published: 19 February 2015
PDF: 5 pages
Proc. SPIE 9449, The International Conference on Photonics and Optical Engineering (icPOE 2014), 944934 (19 February 2015); doi: 10.1117/12.2081156

Published in SPIE Proceedings Vol. 9449:
The International Conference on Photonics and Optical Engineering (icPOE 2014)
Ailing Tian; Anand Asundi; Weiguo Liu; Chunmin Zhang, Editor(s)