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Proceedings Paper

Design and characterization of a silicon piezoresistive three-axial force sensor for micro-flapping wing MAV applications
Author(s): Wei Zhang; Van Tien Truong; Kim Boon Lua; A. Senthil Kumar; Tee Tai Lim; Khoon Seng Yeo; Guangya Zhou
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Paper Abstract

This paper describes the design and electro-mechanical characterizations of a three-axial micro piezoresistive force sensor fabricated by microelectromechanical systems (MEMS) technologies. This is the first three-axial MEMS micro force sensor applied to the study of Micro Aerial Vehicle (MAV) aerodynamics. A standard dry etching fabrication process using Silicon On Insulator (SOI) wafer is employed to fabricate the multi-axis sensors. Conventional cross-beam structure is employed. There are eight piezoresistors on the beams, and each of the silicon strain gauge size is 15 μm in width, and between 400 and 500 μm in length. The Finite Element Method (FEM) analysis for confirming the piezoresistors attachment locations is performed. The miniaturized force sensor (11×11 mm2) is attached at the wing base of a micro flapping wing system (MAV, 70×30 mm2 ) by a short pillar. The sensor is designed to detect the dynamic drag force and lift force generated by a single wing under a moderate flapping frequency (5~10Hz) simultaneously. The characterizations are experimentally investigated. The sensor should be stiff enough to withstand the high inertial force (200 millinewton) and also has high resolution to detect the minimal force correctly. Measurements show that the resolution is on the order of a millinewton. High linearity and low hysteresis under normal forces and tangential forces are demonstrated by applying forces from 0 to 0.1 N. The micro flapping wing mechanism and the assembly of wing and sensor are also discussed in this paper.

Paper Details

Date Published: 4 March 2015
PDF: 10 pages
Proc. SPIE 9302, International Conference on Experimental Mechanics 2014, 93023E (4 March 2015); doi: 10.1117/12.2081146
Show Author Affiliations
Wei Zhang, National Univ. of Singapore (Singapore)
Van Tien Truong, National Univ. of Singapore (Singapore)
Kim Boon Lua, National Univ. of Singapore (Singapore)
A. Senthil Kumar, National Univ. of Singapore (Singapore)
Tee Tai Lim, National Univ. of Singapore (Singapore)
Khoon Seng Yeo, National Univ. of Singapore (Singapore)
Guangya Zhou, National Univ. of Singapore (Singapore)

Published in SPIE Proceedings Vol. 9302:
International Conference on Experimental Mechanics 2014
Chenggen Quan; Kemao Qian; Anand Asundi; Fook Siong Chau, Editor(s)

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