Many research teams have begun pursuing optical micromachining technology in recent years due to its associated noncontact and fast speed characteristics. However, the focal spot sizes and the depth of focus (DOF) strongly influenced the design requirements of the micromachining system. The focal spot size determines the minimum features can be fabricated, which is inversely proportional to the DOF. That is, smaller focal spot size led to shorter DOF. However, the DOF of the emitted visible or near-infrared light beam is typically limited to tens of nanometers for traditional optic system. The disadvantages of using nanosecond laser for micromachining such as burrs formation and surface roughness were found to further influence the accuracy of machined surfaces. To alleviate all of the above-mentioned problems, sub-wavelength annular aperture (SAA) illuminated with 780 nm femtosecond laser were integrated to develop the new laser micromachining system presented in this paper. We first optimized the parameters for high transmittance associated with the SAA structure for the 780 nm femtosecond laser used by adopting the finite difference time domain simulations method. A lateral microscope was modified from a traditional microscope to facilitate the measurement of the emitted light beam optical energy distribution. To verify the newly developed system performance the femtosecond laser was used to illuminate the SAA fabricated on the metallic film to produce the Bessel light beam so as to perform micromachining and process on silicon, PCB board and glass. Experimental results were found to match the original system design goals reasonably well.

Date Published: 12 March 2015
PDF: 6 pages
Proc. SPIE 9351, Laser-based Micro- and Nanoprocessing IX, 93510U (12 March 2015); doi: 10.1117/12.2078804

Published in SPIE Proceedings Vol. 9351:
Laser-based Micro- and Nanoprocessing IX
Udo Klotzbach; Kunihiko Washio; Craig B. Arnold, Editor(s)