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Proceedings Paper

1060-nm VCSEL-based parallel-optical modules for optical interconnects
Author(s): N. Nishimura; K. Nagashima; T. Kise; A. F. Rizky; T. Uemura; Y. Nekado; Y. Ishikawa; H. Nasu
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Paper Abstract

The capability of mounting a parallel-optical module onto a PCB through solder-reflow process contributes to reduce the number of piece parts, simplify its assembly process, and minimize a foot print for both AOC and on-board applications. We introduce solder-reflow-capable parallel-optical modules employing 1060-nm InGaAs/GaAs VCSEL which leads to the advantages of realizing wider modulation bandwidth, longer transmission distance, and higher reliability. We demonstrate 4-channel parallel optical link performance operated at a bit stream of 28 Gb/s 231-1 PRBS for each channel and transmitted through a 50-m-core MMF beyond 500 m. We also introduce a new mounting technology of paralleloptical module to realize maintaining good coupling and robust electrical connection during solder-reflow process between an optical module and a polymer-waveguide-embedded PCB.

Paper Details

Date Published: 3 April 2015
PDF: 8 pages
Proc. SPIE 9368, Optical Interconnects XV, 93680A (3 April 2015); doi: 10.1117/12.2078757
Show Author Affiliations
N. Nishimura, Furukawa Electric Co., Ltd. (Japan)
K. Nagashima, Furukawa Electric Co., Ltd. (Japan)
T. Kise, Furukawa Electric Co., Ltd. (Japan)
A. F. Rizky, Furukawa Electric Co., Ltd. (Japan)
T. Uemura, Furukawa Electric Co., Ltd. (Japan)
Y. Nekado, Furukawa Electric Co., Ltd. (Japan)
Y. Ishikawa, Furukawa Electric Co., Ltd. (Japan)
H. Nasu, Furukawa Electric Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 9368:
Optical Interconnects XV
Henning Schröder; Ray T. Chen, Editor(s)

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