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Proceedings Paper

Adjustable mounting device for high-volume production of beam-shaping systems for high-power diode lasers
Author(s): Sebastian Haag; Henning Bernhardt; Olaf Rübenach; Tobias Haverkamp; Tobias Müller; Daniel Zontar; Christian Brecher
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Paper Abstract

In many applications for high-power diode lasers, the production of beam-shaping and homogenizing optical systems experience rising volumes and dynamical market demands. The automation of assembly processes on flexible and reconfigurable machines can contribute to a more responsive and scalable production. The paper presents a flexible mounting device designed for the challenging assembly of side-tab based optical systems. It provides design elements for precisely referencing and fixating two optical elements in a well-defined geometric relation. Side tabs are presented to the machine allowing the application of glue and a rotating mechanism allows the attachment to the optical elements. The device can be adjusted to fit different form factors and it can be used in high-volume assembly machines. The paper shows the utilization of the device for a collimation module consisting of a fast-axis and a slow-axis collimation lens. Results regarding the repeatability and process capability of bonding side tab assemblies as well as estimates from 3D simulation for overall performance indicators achieved such as cycle time and throughput will be discussed.

Paper Details

Date Published: 1 April 2015
PDF: 6 pages
Proc. SPIE 9346, Components and Packaging for Laser Systems, 93460K (1 April 2015); doi: 10.1117/12.2078418
Show Author Affiliations
Sebastian Haag, Fraunhofer-Institut für Produktionstechnologie (Germany)
Henning Bernhardt, Fraunhofer-Institut für Produktionstechnologie (Germany)
Olaf Rübenach, INGENERIC GmbH (Germany)
Tobias Haverkamp, INGENERIC GmbH (Germany)
Tobias Müller, Fraunhofer-Institut für Produktionstechnologie (Germany)
Daniel Zontar, Fraunhofer-Institut für Produktionstechnologie (Germany)
Christian Brecher, Fraunhofer-Institut für Produktionstechnologie (Germany)

Published in SPIE Proceedings Vol. 9346:
Components and Packaging for Laser Systems
Alexei L. Glebov; Paul O. Leisher, Editor(s)

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