
Proceedings Paper
Power-efficient carrier-depletion SOI Mach-Zehnder modulators for 4x25Gbit/s operation in the O-bandFormat | Member Price | Non-Member Price |
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Paper Abstract
In this paper, we communicate on the design, fabrication, and testing of optical modulators for Silicon-based photonic
integrated circuits (Si-PICs) in the O-band (1.31 μm), targeting the 100GBASE-LR4 norm (4 wavelengths at 25 Gbit/s).
The modulators have been conceived to be later coupled with hybrid-III-V/Si lasers as well as echelle grating
multiplexer, to create a hetero-integrated optical transmitter on a silicon-on-insulator (SOI) platform. The devices are
based on a Mach-Zehnder Interferometer (MZI) architecture, where a p-n junction is implanted to provide optical
modulation through carrier depletion. A detailed study focusing on the best doping scheme for the junction, aimed at
optimizing the overall transmitter performance and power-efficiency is presented. In detail, the trade-off between low
optical losses and high modulation efficiency is tackled, with a targeted CMOS-compatible voltage drive of 2.5 V.
Process simulations of the junction are realized for the doping profile optimization. Modulators of different lengths are
also investigated to study the compromise between extinction ratio, insertion losses and bandwidth. Furthermore,
coplanar-strip (SGS) travelling-wave electrodes are designed to maximize the bandwidth, to reach the targeted bit rate of
25 Gbit/s. Measurements show modulation efficiencies up to 19 °/mm (or 2.4 V.cm) for a 2.5 V input voltage, with
doping-related losses below 1 dB/mm, in line with theoretical estimates, and well-suited to enhance the Si-PIC
transmission and power-efficiency. Finally, an electro-optical (EO) bandwidth at 1.25 V bias is measured above 28 GHz.
Paper Details
Date Published: 27 February 2015
PDF: 11 pages
Proc. SPIE 9367, Silicon Photonics X, 93670D (27 February 2015); doi: 10.1117/12.2078364
Published in SPIE Proceedings Vol. 9367:
Silicon Photonics X
Graham T. Reed; Michael R. Watts, Editor(s)
PDF: 11 pages
Proc. SPIE 9367, Silicon Photonics X, 93670D (27 February 2015); doi: 10.1117/12.2078364
Show Author Affiliations
Thomas Ferrotti, STMicroelectronics (France)
CEA-LETI (France)
Alain Chantre, STMicroelectronics (France)
Benjamin Blampey, CEA-LETI (France)
Hélène Duprez, CEA-LETI (France)
Frédéric Milesi, CEA-LETI (France)
André Myko, CEA-LETI (France)
Corrado Sciancalepore, CEA-LETI (France)
CEA-LETI (France)
Alain Chantre, STMicroelectronics (France)
Benjamin Blampey, CEA-LETI (France)
Hélène Duprez, CEA-LETI (France)
Frédéric Milesi, CEA-LETI (France)
André Myko, CEA-LETI (France)
Corrado Sciancalepore, CEA-LETI (France)
Karim Hassan, CEA-LETI (France)
Julie Harduin, CEA-LETI (France)
Charles Baudot, STMicroelectronics (France)
Sylvie Menezo, CEA-LETI (France)
Frédéric Boeuf, STMicroelectronics (France)
Badhise Ben Bakir, CEA-LETI (France)
Julie Harduin, CEA-LETI (France)
Charles Baudot, STMicroelectronics (France)
Sylvie Menezo, CEA-LETI (France)
Frédéric Boeuf, STMicroelectronics (France)
Badhise Ben Bakir, CEA-LETI (France)
Published in SPIE Proceedings Vol. 9367:
Silicon Photonics X
Graham T. Reed; Michael R. Watts, Editor(s)
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