
Proceedings Paper
International standardisation of optical circuit board measurement and fabrication proceduresFormat | Member Price | Non-Member Price |
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Paper Abstract
Widespread adoption of optical circuit boards will herald substantial performance, environmental and cost benefits for
the data communications industry. Though optical circuit board technology has advanced considerably over the past
decade, commercial maturity will be gated by the availability of conformity standards to forge future quality assurance
procedures. One important prerequisite to this is a reliable test and measurement definition system, which is agnostic to
the type of waveguide system under test and therefore can be applied to different optical circuit board technologies as
well as being adaptable to future variants. A serious and common problem with the measurement of optical waveguide
systems has been lack of proper definition of the measurement conditions for a given test regime, and consequently
strong inconsistencies ensue in the results of measurements by different parties on the same test sample. We report on the
development of a new measurement identification standard to force testers to capture sufficient information about the
measurement conditions for a given optical circuit board such as to ensure consistency of measurement results within an
acceptable margin. Furthermore we demonstrate how the application of the measurement identification system can bring
about a dramatic improvement in results consistency, by comparative evaluation of the results on multimode polymer
waveguide based optical circuit test boards from a large selection of testing organisations.
Paper Details
Date Published: 3 April 2015
PDF: 10 pages
Proc. SPIE 9368, Optical Interconnects XV, 93680W (3 April 2015); doi: 10.1117/12.2077654
Published in SPIE Proceedings Vol. 9368:
Optical Interconnects XV
Henning Schröder; Ray T. Chen, Editor(s)
PDF: 10 pages
Proc. SPIE 9368, Optical Interconnects XV, 93680W (3 April 2015); doi: 10.1117/12.2077654
Show Author Affiliations
Richard Pitwon, Seagate Technology LLC (United Kingdom)
Kai Wang, Seagate Technology LLC (United Kingdom)
Marika Immonen, TTM Technologies, Inc. (Finland)
Jinhua Wu, TTM Technologies, Inc. (China)
Kai Wang, Seagate Technology LLC (United Kingdom)
Marika Immonen, TTM Technologies, Inc. (Finland)
Jinhua Wu, TTM Technologies, Inc. (China)
Long Xiu Zhu, TTM Technologies, Inc. (China)
Hui Juan Yan, TTM Technologies, Inc. (China)
Alex Worrall, Seagate Technology LLC (United Kingdom)
Hui Juan Yan, TTM Technologies, Inc. (China)
Alex Worrall, Seagate Technology LLC (United Kingdom)
Published in SPIE Proceedings Vol. 9368:
Optical Interconnects XV
Henning Schröder; Ray T. Chen, Editor(s)
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