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Proceedings Paper

Development and qualification of a mechanical-optical interface for parallel optics links
Author(s): S. Chuang; D. Schoellner; A. Ugolini; J. Wakjira; G. Wolf
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Paper Abstract

As parallel optics applications continue to expand, there remains a need for an effective coupling interface between the board-level active components and the passive components of the network. While mid-board level photonic turn connectors are available, coupling interfaces are generally not available outside of proprietary solutions. Development of a general mechanical-optical coupling interface opens the door for broader parallel optics implementation. An interface for use between the optical transmitter and the photonic turn connector is introduced. The interface is a monolithic injection molded component with an array of collimating lenses to couple efficiently with common VCSEL/PD designs. The component has precise epoxy control features to manage epoxy bond-line thickness and strength. Suitable UV and thermal epoxies have been qualified for effective die bond placement of the component in the VCSEL/PD environment. Environmental and mechanical performance of the component to industry-standard qualification requirements are reviewed, and tensile force testing and durability results validate the mechanical characteristics of the interface.

Paper Details

Date Published: 3 April 2015
PDF: 8 pages
Proc. SPIE 9368, Optical Interconnects XV, 936811 (3 April 2015); doi: 10.1117/12.2077597
Show Author Affiliations
S. Chuang, US Conec Ltd. (United States)
D. Schoellner, US Conec Ltd. (United States)
A. Ugolini, US Conec Ltd. (United States)
J. Wakjira, US Conec Ltd (United States)
G. Wolf, US Conec Ltd (United States)

Published in SPIE Proceedings Vol. 9368:
Optical Interconnects XV
Henning Schröder; Ray T. Chen, Editor(s)

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